NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Improve Reliability

16 Feb, 2021

NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Improve Reliability
Photo by Alex Knight on Unsplash

– NextFlex® Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Improve Reliability
– NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today released Project Call 6.0 (PC 6.0). The latest call for proposals seeks to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing.
– The total PC 6.0 project value is expected to exceed $14.3M (project value/investment figures include cost-sharing), bringing the total anticipated investment in advancing FHE since NextFlex’s formation to $113M.

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